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DATA SHEET
SKY65066-360LF: 2.3-2.7 GHz Low Noise Amplifier
Applications
Wireless infrastructure: WLAN, Bluetooth, WiMAX, LTE, and WCDMA Ultra-low noise applications
InterStage Match
Figure 1. SKY65066-360LF Block Diagram
Features
Ultra-low Noise Figure = 0.70 dB @ 2.5 GHz Excellent input and output return loss Adjustable gain = 16.5 to 20.5 dB @ 2.5 GHz High output OIP3 = +35.5 dBm @ 75 mA OP1dB = +18 dBm @ 2.5 GHz Single, positive DC supply voltage Adjustable supply current, 30 to 100 mA Integrated on-die source inductors and interstage matching network Small, QFN (8-pin, 2 x 2 mm) package (MSL1, 260 C per JEDEC J-STD-020)
Description
The SKY65066-360LF is a high performance, two-stage ultra-Low Noise Amplifier (LNA). The device is fabricated from Skyworks advanced pHEMT process and is provided in a 2 x 2 mm, 8-pin Quad Flat No-Lead (QFN) package. The device features excellent input and output return loss, and an integrated interstage matching network. The amplifier's ultra-low Noise Figure (NF), high gain, and excellent 3rd Order Intercept point (IP3) allow it to be used in various receiver and transmitter applications. A functional block diagram is shown in Figure 1. The pin configuration and package are shown in Figure 2. Signal pin assignments and functional pin descriptions are provided in Table 1.
BIAS1 RFIN N/C VDD1
1
8
BIAS2 RFOUT/VDD2 N/C FEEDBACK
2
7
3
6
4
5
Figure 2. SKY65066-360LF Pinout - 8-Pin QFN (Top View)
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DATA SHEET * SKY65066-360LF LOW NOISE AMPLIFIER
Table 1. SKY65066-360LF Signal Descriptions
Pin # 1 2 3 4 BIAS1 RFIN N/C VDD1 Name Description Source lead for 1 stage transistor RF input No connection 1st stage DC power supply
st
Pin # 5 6 7 8
Name FEEDBACK N/C RFOUT/VDD2 BIAS2
Description Connect to RFOUT/VDD2 to reduce gain of 2nd stage transistor No connection RF output. Requires a DC bias using an RF choke inductor. Source lead for 2nd stage transistor
Functional Description
The SKY65066-360LF is a two stage LNA with an integrated interstage matching network and source inductors. The device has a tested low NF of 0.7 dB and gain of 16.5 dB. The device allows designers to adjust current and gain without degrading the NF. The external matching network largely dictates the RF performance of the device. The matching network is required for operation and special care should be taken when designing a circuit board layout for the SKY65066-360LF. There are four separate groups of external components: input, output, biasing, and feedback. Biasing To properly bias a depletion mode pHEMT, both the gate and drain of the device must be biased properly. At VGS = 0 V and VDS > 2 V, the amplifier stage is in its saturated state and draws the maximum amount of current, IDSS. A VDS of 5 V is recommended to ensure proper performance. To eliminate the need for a negative DC supply, self-biasing should be used when a resistor is placed between one of the source leads and ground. A bypass capacitor should be placed in parallel to this resistor to provide an RF ground and to ensure performance remains unchanged at the operating frequency. When current flows from drain to source and through the resistor, the source voltage becomes biased above DC ground. The gate pin of the device should be left unbiased at 0 V, which creates the desired negative VGS value. This simplifies the design by eliminating the need for a second DC supply. Values for resistor components R1 and R2 can be changed to easily increase or decrease the bias current to a desired level. The first stage is biased at 20 percent of IDSS to achieve the best NF performance. The gain and current of the 2nd stage amplifier can be adjusted without degrading the overall NF. More current in the 2nd stage yields better IP3 performance. Biasing components R1, R2, C1, and C2 should be placed as close to the package pins as possible. See Figure 12 for the recommended board layout.
Source Inductance The source inductance required on pins 1 and 8 (BIAS1 and BIAS2 signals, respectively) has been integrated on the die. This simplifies board layout and reduces build variations. Input and Output RF Matching Network The input band-pass matching network consists of four components. Component C1 serves as the input DC blocking capacitor, C2 provides high frequency stability and improved input return loss, and L1 and L2 are responsible for the best noise match looking into the gate of the first stage amplifier. Excess board trace should be eliminated at the input of the device to minimize board losses. High-Q components should be used to achieve the best NF of the amplifier. Murata GJM series capacitors and Coilcraft HP or CS series inductors are recommended. Any excess board or component loss on the input of the device directly adds to the total measured NF. The output matching network is band-pass network optimized for output return loss. The SKY65066-360LF Evaluation Board assembly diagram is shown in Figure 13 and a circuit schematic is provided in Figure 14. Feedback Feedback is implemented in the recommended circuit on the 2nd stage transistor. Feedback improves the input and output return loss and high frequency stability. The gain of the device can be increased by increasing the value of R3, which reduces the amount of feedback present (gain for multiple feedback resistor values is shown in Figure 12).
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DATA SHEET * SKY65066-360LF LOW NOISE AMPLIFIER
Measuring NF Special care should be taken when making < 1 dB NF measurements. Ideally, measurements should be made in an RF shield room. An Agilent MXA N9020A spectrum analyzer with an internal pre-amp paired with an N4001A smart noise source was used for all noise measurements. The smart noise source has an internal thermocouple that automatically sets the TCOLD setting on the analyzer. If a smart noise source is unavailable, a standard low Excess Noise Ratio (ENR) source should be used. Use an external thermocouple to manually adjust the TCOLD setting to ensure accurate results.
Electrical and Mechanical Specifications
The absolute maximum ratings of the SKY65066-360LF are provided in Table 2. The recommended operating conditions are specified in Table 3 and electrical specifications are provided in Table 4. Performance characteristics for the SKY65066-360LF are illustrated in Figures 3 through 12.
Table 2. SKY65066-360LF Absolute Maximum Ratings
Parameter Supply voltage Input power Supply current stage one Supply current stage two Power dissipation Junction temperature Storage temperature Operating temperature Thermal resistance
Note:
Symbol VDD PIN IDS1 IDS2 PDIS TJ TSTG TOP QJC
Minimum
Typical 5.5 +10 50 100 530 150
Maximum
Units V dBm mA mA mW C
-65 -40 47
+125 +85
C C C/W
Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times.
Table 3. SKY65066-360LF Recommended Operating Conditions
Parameter Operating frequency Supply voltage Supply current f VDD IDD Symbol Minimum 2.3 4.75 30 5.00 75 Typical Maximum 2.7 5.25 100 Units GHz V mA
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DATA SHEET * SKY65066-360LF LOW NOISE AMPLIFIER
Table 4. SKY65066-360LF Electrical Specifications (Note 1) (TOP = +25 C, Characteristic Impedance [ZO] = 50 , VDD = 5 V, IDD = 75 mA, f = 2.5 GHz, Parameters Include Recommended 2.3 to 2.7 GHz Matching Network, Unless Otherwise Noted)
Parameter Noise Figure (Note 2) Gain Input return loss Output return loss Reverse isolation 3 Order Output Intercept Point 3rd Order Input Intercept Point 1 dB Output Compression Point 1 dB Input Compression Point Stability
rd
Symbol NF |S21| |S11| |S22| |S12| OIP3 IIP3 OP1dB IP1dB
Test Condition
Min
Typical 0.7
Max 0.9
Units dB dB dB dB dB dBm dBm dBm dBm K
15.0
16.5 -20 -14 -27
10 MHz spacing, PIN = -18 dBm per tone 10 MHz spacing, PIN = -18 dBm per tone
+35.5 +19 +18 +2.5
Unconditionally stable up to 18 GHz
>1
Note 1: Performance is guaranteed only under the conditions listed in this Table and is not guaranteed over the full operating or storage temperature ranges. Exceeding any of the conditions listed here may result in permanent damage to the device. Operation at elevated temperatures may reduce reliability of the device. Note 2: NF of device and matching network. Input RF connector and board loss de-embedded from measurement.
Typical Performance Characteristics
(TOP = +25 C, Characteristic Impedance [ZO] = 50 , VDD = 5 V, IDD = 75 mA, Parameters Include a Recommended 2.3 to 2.7 GHz Matching Network, Unless Otherwise Noted)
25 20
0 -5
+85 oC +25 oC -40 oC
Small Signal Gain (dB)
Input Return Loss (dB)
3.0
-10 -15 -20 -25 -30 -35
15 10 5 0 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9
+85 C +25 oC -40 oC
o
-40 2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3.0
Frequency (GHz)
Frequency (GHz)
Figure 3. Small Signal Gain vs Frequency Over Temperature, (PIN = -20 dBm)
Figure 4. Input Return Loss vs Frequency Over Temperature, (PIN = -20 dBm)
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DATA SHEET * SKY65066-360LF LOW NOISE AMPLIFIER
0 -5
+85 oC +25 oC -40 oC
0 -2
Reverse Isolation (dB)
Output Return Loss (dB)
-10 -15 -20 -25 -30 -35 -40 -45 -50 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8
-4 -6 -8 -10 -12 -14 -16 -18 -20 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8
+85 oC +25 oC -40 oC
2.9
3.0
2.9
3.0
Frequency (GHz)
Frequency (GHz)
Figure 5. Reverse Isolation vs Frequency Over Temperature, (PIN = -20 dBm)
Figure 6. Output Return Loss vs Frequency Over Temperature, (PIN = -20 dBm)
1.4 1.2
+40 +39 +38
+85 oC +25 oC -40 oC
Noise Figure (dB)
1.0
+37
OIP3 (dBm)
+85 oC +25 oC -40 oC
0.8 0.6 0.4 0.2 0 2.30 2.35 2.40 2.45 2.50 2.55 2.60
+36 +35 +34 +33 +32 +31 +30 2.35
2.65
2.70
2.40
2.45
2.50
2.55
2.60
2.65
2.70
2.75
Frequency (GHz)
Frequency (GHz)
Figure 7. Noise Figure vs Frequency Over Temperature, Input RF Connector and Board Trace De-Embedded From Measurement
Figure 8. OIP3 vs Frequency Over Temperature, (PIN = -20 dBm)
20 19 18 17 16 15 14 13 12 11 10 -20
+40 +38 +36
OIP3 (dBm)
2500 MHz +85 oC 2400 MHz +25 oC 2600 MHz -40 oC 2400 MHz +85 oC 2700 MHz +25oC 2500 MHz -40 oC 2700 MHz +85 oC 2600 MHz +25 oC 2400 MHz -40 oC 2600 MHz +85 oC 2500 MHz +25 oC 2700 MHz -40 oC
Gain (dB)
+34 +32 +30 +28
2400 MHz +85 oC 2400 MHz +25 oC 2400 MHz -40 oC 2500 MHz +85 oC 2500 MHz +25oC 2500 MHz -40 oC 2600 MHz +85 oC 2600 MHz +25 oC 2600 MHz -40 oC 2700 MHz +85 oC 2700 MHz +25 oC 2700 MHz -40 oC
-15
-10
-5
0
+5
+10
+26 -16
-14
-12
-10
-8
-6
-4
-2
0
Input Power (dBm)
Input Power Per Tone (dBm)
Figure 9. Gain vs Input Power Over Temperature and Frequency
Figure 10. OIP3 vs Input Power Over Temperature and Frequency (Tone Spacing = 5 MHz)
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DATA SHEET * SKY65066-360LF LOW NOISE AMPLIFIER
8 7 6 5
1 -40 oC 1 +25 oC 1 +85 oC 2 -40 oC 2 +25 oC 2 +85 oC
24 22
Small Signal Gain (dB)
1, 2
20 18 16 14 12
10 50 100 200 500 Removed
4 3 2 1 0 0 2 4 6 8 10
12
14
16
18
10 2.30
2.35
2.40
2.45
2.50
2.55
2.60
2.65
2.70
Frequency (GHz)
Frequency (GHz)
Figure 11. Stability vs Frequency Over Temperature (PIN = -20 dBm)
Figure 12. Small Signal Gain vs Frequency for Multiple Feedback Resistor Values
Evaluation Board Description
The SKY65066-360LF Evaluation Board is used to test the performance of the SKY65066-360LF low noise amplifier. An assembly drawing for the Evaluation Board is shown in Figure 13. The Evaluation Board schematic diagram is shown in Figure 14. Table 5 provides the Bill of Materials (BOM) list for Evaluation Board components. Input and output trace lengths have been minimized to reduce losses. All surface mount components are 0402-sized to reduce component parasitics. The use of 0603 or larger components is not recommended. Component spacing has also been minimized. The board is provisioned with two RF connectors and a DC launch. The RF connector and board loss up to component C1 is approximately 1 dB at 2500 MHz. It is very important to place multiple ground vias as close to shunt components as possible. This ensures proper grounding and circuit performance. Board material is 10 mil thick VT47 FR4 with 1 oz. copper cladding. RF input and output traces are 50 . Evaluation Board Test Procedure Step 1: Connect RF test equipment to amplifier input/output SMA connectors. Step 2: Connect DC ground. Step 3: Connect VDD to a +5 V supply with a current limit of 100 mA. Verify that the board draws approximately 75 mA. Step 4: Apply RF signal or noise source.
Package Dimensions
The PCB layout footprint for the SKY65066-360LF is shown in Figure 15. Typical case markings are shown in Figure 16. Package dimensions for the 8-pin QFN are shown in Figure 17, and tape and reel dimensions are provided in Figure 18.
Package and Handling Information
Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. THE SKY65066-360LF is rated to Moisture Sensitivity Level 1 (MSL1) at 260 C. It can be used for lead or lead-free soldering. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. Production quantities of this product are shipped in a standard tape and reel format. For packaging details, refer to the Skyworks Application Note, Discrete Devices and IC Switch/Attenuators Tape and Reel Package Orientation, document number 200083.
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PRELIMINARY DATA SHEET * SKY65066-360LF LOW NOISE AMPLIFIER
S1513
Figure 13. SKY65066-360LF Evaluation Board Assembly Diagram
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DATA SHEET * SKY65066-360LF LOW NOISE AMPLIFIER
C4
R1
C5
R2
1 C3 2
BIAS1
BIAS2
8 C9
C1 RF Input C14 L1 C2
L2
C16 RF Output
RFIN
RFOUT/VDD2 7
C7 C8 L4 C15
x
3
N/C
N/C
6
x
C6 R3
4
VDD1
FEEDBACK 5
C18
C11
L5
L3
R5
C10 C17 R4
C13
C12 VDD Note: Some component labels may be different than the corresponding component symbol shown here. Component values, however, as noted in Table 5, are accurate as of the date of this Data Sheet.
C19
S1514
Figure 14. SKY65066-360LF Evaluation Board Schematic
Table 5. SKY65066-360LF (QFN Package) Evaluation Board Bill of Materials (1 of 2)
Component C1 C2 C3, C8, C10, C12, C14, C19 C4 C5 C6 C7 C9 C11 C13 C15 C16 C17 C18 L1 L2 L3 L4 L5 30 pF 7.5 nH DNP 30 pF 4700 pF 0.3 pF 51 2.4 pF 0.4 pF 1000 pF 0.1 pF 2.0 nH 6 pF 10 pF 0.1 pF 1.2 nH 27 nH 5.6 nH 5.6 nH 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 0402 Murata GRM1555C Murata GRM1555C Murata GJM1555C Panasonic ERJ2RKF Murata GJM1555C Murata GJM1555C Murata GRM1555C Murata GJM1555C TDK MLG1005S Murata GJM1555C Murata GJM1555C Murata GJM1555C Coilcraft CS TDK MLG1005S TDK MLG1005S TDK MLG1005S Value 0402 0402 Size Manufacturer/Part Series Murata GRM1555C Coilcraft CS
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DATA SHEET * SKY65066-360LF LOW NOISE AMPLIFIER
Table 5. SKY65066-360LF (QFN Package) Evaluation Board Bill of Materials (2 of 2)
Component R1 R2 R3 R4 R5 22 6.8 DNP 91 22 0402 0402 Panasonic ERJ2RKF Panasonic ERJ2RKF Value 0402 0402 Size Manufacturer/Part Series Panasonic ERJ2RKF Panasonic ERJ2GE
8X 0.70
R0.20 Pin 1
8X 0.45
8X 0.25
0.50 Pitch 2X 0.85 0.25
2X 0.45
All dimensions are in millimeters
Exposed Solder Areas (Typical)
S1413
Figure 15. SKY65066-360LF PCB Layout Footprint
Pin 1 Indicator Skyworks Part #
Figure 16. Typical Case Markings (Top View)
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S66
DATA SHEET * SKY65066-360LF LOW NOISE AMPLIFIER
C 2 A B 0.20 Ref Seating Plane 0.02 +0.03/-0.02
0.90 +0.10/-0.15 0.45 +0.05/-0.07 Exposed Pad Detail A -B8X 3 0.08 C Detail B 2 Places Detail C
Pin 1 Indicator
2 2X 0.15 C
1.70 +0.10/-0.15 0.85 +0.05/-0.07
2X
0.15 C
0.90 0.10 0.10 C
Top View
R0.12 Typ
Side View
Bottom View
0.30 0.10 -A0.25 +0.05/-0.07 5
0.10 M C A B 0.05 M C
0.25
C L
0.5
R0.20
Detail C
8 Places
Detail B
Detail A
All measurements are in millimeters. Dimensioning and tolerancing according to ASME Y14.5M-1994. Coplanarity applies to the exposed heat sink slug as well as the terminals.. Plating requirement per source control drawing (SCD) 2504. Dimension applies to metalized terminal and is measured between 0.15 mm and 0.30 mm from terminal tip.
S1415
Figure 17. SKY65066-360LF 8-Pin QFN Package Dimensions
1.50+ P0.10/-0.00 Pin #1 4.00 0.10 4.00 0.10 2.00 0.05 1.75 0.10
0.30 0.01 (T)
B
3.50 0.05
2.60 0.10 (Bo)
A
A
B 1.20 0.10 (Ko) 2.60 0.10 (Ao)
1.00 Min.
B
R0.30 Max
A
Notes: 1. Carrier tape: black conductive polystyrene. 2. Cover tape material: transparent conductive HSA. 3. Cover tape size: 5.40 mm width. 4. All measurements are in millimeters.
S1480
Figure 18. SKY65066-360LF Tape and Reel Dimensions
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8.00 +0.30/-0.10
R0.30 Max
DATA SHEET * SKY65066-360LF LOW NOISE AMPLIFIER
Ordering Information
Model Name SKY65066-360LF Low Noise Amplifier Manufacturing Part Number SKY65066-360LF (Pb-free and Green package) Evaluation Kit Part Number SKY65066-360LF (2.3-2.7 GHz)
Copyright (c) 2009 Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. ("Skyworks") products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes. No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and Conditions of Sale. THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury, death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale. Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters. Skyworks, the Skyworks symbol, and "Breakthrough Simplicity" are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are incorporated by reference.
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